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W66BQ2NQQAFJ

Part number W66BQ2NQQAFJ
Product classification Memory
Manufacturer Winbond Electronics Corporation
Description 2GB LPDDR4X, DDP, X32, 1600MHZ,
Encapsulation
Packing Tray
Quantity 1200
RoHS status NO
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Inventory:
Total number

Quantity

Price

Total price

1

$7.0665

$7.0665

10

$6.3840

$63.8400

25

$6.0900

$152.2500

80

$5.2815

$422.5200

230

$5.0505

$1,161.6150

440

$4.5990

$2,023.5600

945

$4.0110

$3,790.3950

2400

$3.8640

$9,273.6000

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Product parameters
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TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4X
Clock Frequency1.6 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_06
Access Time3.6 ns
Memory Organization64M x 32

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 2.4K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 1.5K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 3K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES 68 OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 560 OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 5.1K OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 43K OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 47K OHM 5% 1W AXIAL
Vishay General Semiconductor – Diodes Division
DIODE GEN PURP 800V 12A DO203AA
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